US Patent Issued to LENOVO (BEIJING) on Aug. 4 for "Thermal conductive element and electronic device" (Chinese Inventor)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,676, issued on Aug. 4, was assigned to LENOVO (BEIJING) Ltd. (Beijing).

"Thermal conductive element and electronic device" was invented by Cong Zeng (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "A thermal conductive element includes a thermal conductive sheet and a target piece. The target piece is configured to be disposed in a target area of the thermal conductive sheet, and the target piece makes a target part of the thermal conductive sheet deform to form a first protrusion."

The patent was filed on Feb. 7, 2024, under Application No. 18/435,111.

*For further information, including images, charts and tables, please visit: http://patft...