US Patent Issued to LEDVANCE on March 24 for "Light emitting diode filament including flip chip light emitting diodes to reduce the amount of phosphor that is integrated into the filament" (Chinese, American Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,335, issued on March 24, was assigned to LEDVANCE LLC (Wilmington, Mass.).

"Light emitting diode filament including flip chip light emitting diodes to reduce the amount of phosphor that is integrated into the filament" was invented by Xinrong Wang (Shenzhen, China), Tianzheng Jiang (Shenzhen, China) and Ming Li (Acton, Mass.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A light emitting diode (LED) structure that includes a stent substrate; and a circuit having a plurality of contact pads arranged along a length of the stent substrate. The structure further includes a plurality of light emitting diode (LED) chips, wherein each light emitting diode...