US Patent Issued to LAPIS TECHNOLOGY on July 14 for "Semiconductor device and manufacturing method of semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,180, issued on July 14, was assigned to LAPIS TECHNOLOGY Co. LTD. (Yokohama, Japan).

"Semiconductor device and manufacturing method of semiconductor device" was invented by Osamu Koike (Yokohama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a semiconductor substrate having a surface with a metal wiring on the surface, an insulating film that covers the surface of the semiconductor substrate, and a plurality of electrodes disposed on the insulating film and having mutually same planar shapes. The insulating film has a plurality of opening portions formed to face respective bottom surfaces of the plurality of el...