US Patent Issued to Lam Research on Sept. 22 for "High precision edge ring centering for substrate processing systems" (California Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,744,191, issued on Sept. 22, was assigned to Lam Research Corp. (Fremont, Calif.).

"High precision edge ring centering for substrate processing systems" was invented by Hui Ling Han (Alameda, Calif.), Seetharaman Ramachandran (San Jose, Calif.) and Marc Estoque (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An edge ring centering system for a plasma processing system includes a processing chamber including a substrate support and R edge ring lift pins, where R is an integer greater than or equal to 3. An edge ring includes P grooves located on a bottom surface thereof, where P is an integer greater than or equal to R. A robot arm incl...