ALEXANDRIA, Va., March 24 -- United States Patent no. 12,586,765, issued on March 24, was assigned to Lam Research Corp. (Fremont, Calif.).

"Surface modification for metal-containing photoresist deposition" was invented by Jengyi Yu (San Ramon, Calif.), Da Li (Newark, Calif.), Younghee Lee (Pleasanton, Calif.), Samantha SiamHwa Tan (Newark, Calif.), Alan J. Jensen (Mountain House, Calif.), Jun Xue (Fremont, Calif.) and Mary Anne Manumpil (Fremont, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Techniques described herein relate to methods, apparatus, and systems for promoting adhesion between a substrate and a metal-containing photoresist. For instance, the method may include receiving the substrate i...