ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,559,853, issued on Feb. 24, was assigned to Lam Research Corp. (Fremont, Calif.).
"Differential contrast plating for advanced packaging applications" was invented by Stephen J. Banik II (Philadelphia), Jacob Kurtis Blickensderfer (Portland, Ore.), Kailash Venkatraman (Portland, Ore.), Justin Oberst (Beaverton, Ore.), Lee Peng Chua (Beaverton, Ore.), Bryan L. Buckalew (Tualatin, Ore.) and Steven T. Mayer (Aurora, Ore.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of electroplating a metal into features, having substantially different depths, of a partially fabricated electronic device on a substrate is provided. The method includes adsorbing ac...