ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,703,911, issued on Aug. 11, was assigned to Lam Research Corp. (Fremont, Calif.).

"Substantially carbon-free molybdenum-containing and tungsten-containing films in semiconductor device manufacturing" was invented by Kyle Jordan Blakeney (Fremont, Calif.), Chiukin Steven Lai (Sunnyvale, Calif.), Thomas M. Pratt (San Jose, Calif.), Eric H. Lenz (Livermore, Calif.) and Jason Stevens (Los Altos, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Substantially carbon-free molybdenum-containing and tungsten-containing films are deposited on semiconductor substrates using halide-free metalorganic precursors. The precursors do not include metal-carbon bonds,...