ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,708, issued on April 14, was assigned to Lam Research Corp. (Fremont, Calif.).
"Atomic layer etch systems for selectively etching with halogen-based compounds" was invented by Dong Woo Paeng (Albany, Calif.), Yunsang Kim (Monte Sereno, Calif.) and He Zhang (Fremont, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing system includes a processing chamber, a substrate support, a heat source, a gas delivery system and a controller. The substrate support is disposed in the processing chamber and supports a substrate. The heat source heats the substrate. The gas delivery system supplies a process gas to the processing chamber. T...