US Patent Issued to Laird Technologies (Shenzhen) on May 12 for "Thermal interface material assemblies" (Chinese, American Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,625,331, issued on May 12, was assigned to Laird Technologies (Shenzhen) Ltd. (Shenzhen, China).

"Thermal interface material assemblies" was invented by Ping Wang (Shenzhen, China), Qiuju Wu (Shenzhen, China), Jianshan Liao (Shenzhen, China), Jingqi Zhao (Shenzhen, China) and Weiqing Guo (Palto Alto, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Exemplary embodiments are disclosed of thermal interface solutions for sliding surfaces. In an exemplary embodiment, a thermal interface material assembly includes a substrate having opposite first and second surfaces. An antifriction layer is along the first surface of the substrate. A thermal interface ...