ALEXANDRIA, Va., May 12 -- United States Patent no. 12,624,248, issued on May 12, was assigned to L'Air Liquide Societe Anonyme pour l'Etude et l'Exploitation des Procedes Georges Claude (Paris) and American Air Liquide Inc. (Fremont, Calif.).

"Curable formulations for forming low-k dielectric silicon-containing films using polycarbosilazane" was invented by Yumin Liu (San Jose, Calif.), Jean-Marc Girard (Versailles, France), Peng Zhang (Montvale, N.J.), Fan Qin (Bear, Del.), Gennadiy Itov (Flemington, N.J.), Fabrizio Marchegiani (Wilmington, Del.), Thomas J. Larrabee (Middletown, Del.) and Venkateswara R. Pallem (Hockessin, Del.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming a gap fillin...