ALEXANDRIA, Va., March 3 -- United States Patent no. 12,565,346, issued on March 3, was assigned to KYOTO SEISAKUSHO Co. LTD. (Kyoto, Japan) and CHUGAI SEIYAKU K.K. (Tokyo).
"Chemical solution enclosing device and chemical solution enclosing method" was invented by Hiroaki Higashi (Kyoto, Japan), Keiji Hirota (Tokyo) and Hideaki Hosaka (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A chemical solution enclosing device that inserts a plug into a barrel containing a chemical solution includes, a sleeve inserted into a barrel in such a manner that a tip end of the sleeve comes near a liquid surface of the chemical solution, a push rod pushing the plug inserted in the sleeve; and a suction depressurizatio...