US Patent Issued to KYOCERA on Sept. 15 for "Wiring board" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,739,972, issued on Sept. 15, was assigned to KYOCERA Corp. (Kyoto, Japan).

"Wiring board" was invented by Hidetoshi Yugawa (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring board according to the present disclosure includes a first insulation layer in which first insulating fillers are dispersed, and a second insulation layer located on an upper surface of the first insulation layer. The first insulation layer includes a protruding filler located protruding from the upper surface of the first insulation layer among the first insulating fillers and a coating film covering a part or all of a protruding surface of the protruding filler...