US Patent Issued to KYOCERA on May 5 for "Wiring board" (Japanese Inventors)

ALEXANDRIA, Va., May 5 -- United States Patent no. 12,621,928, issued on May 5, was assigned to KYOCERA Corp. (Kyoto, Japan).

"Wiring board" was invented by Takafumi Oyoshi (Osaka, Japan) and Suguru Kadowaki (Moriyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring board includes a first insulation layer comprising first and second surfaces; a second insulation layer located at an outermost layer on the first surface; a third insulation layer located at an outermost layer on the second surface; a first mounting region located on an outermost surface on the first surface; a second mounting region located on the outermost surface on the first surface and surrounding the first mounting region; a ...