US Patent Issued to KYOCERA on March 31 for "Paste composition and semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,589,451, issued on March 31, was assigned to KYOCERA Corp. (Kyoto, Japan).

"Paste composition and semiconductor device" was invented by Yuya Nitanai (Yokohama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "This paste composition includes silver particles (A), a thermosetting resin (B), a curing agent (C), and a solvent (D). A shrinkage rate after curing of the paste composition is 15% or less."

The patent was filed on Aug. 4, 2021, under Application No. 18/042,894.

*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool....