ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,700, issued on April 7, was assigned to KYOCERA Corp. (Kyoto, Japan).
"Wiring board" was invented by Hiroaki Sano (Kagoshima, Japan), Toshifumi Higashi (Kirishima, Japan), Akira Imoto (Kirishima, Japan), Takafumi Yamaguchi (Kirishima, Japan) and Sentarou Yamamoto (Kagoshima, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "The wiring board includes an insulation layer made of ceramic and a conductor layer extending in a planar direction inside the insulation layer. The conductor layer is constituted by a sintered body of a plurality of crystallites containing a metal as a main component, and has a layered structure in which a dense layer, a non-...