US Patent Issued to KYOCERA on April 21 for "Thermosetting resin composition, semiconductor device and electrical/electronic component" (Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,606,723, issued on April 21, was assigned to KYOCERA Corp. (Kyoto, Japan).

"Thermosetting resin composition, semiconductor device and electrical/electronic component" was invented by Masakazu Fujiwara (Warabi, Japan), Yu Satake (Yokohama, Japan) and Yuya Nitanai (Yokohama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There are provided a thermosetting resin composition for semiconductor bonding and a thermosetting resin composition for light emitting device which have high thermal conductivity and an excellent heat dissipation property and are capable of reliable pressure-free bonding of a semiconductor element and a light emitting element to a...