US Patent Issued to KYOCERA AVX Components on Sept. 22 for "Package-on-package assembly containing a decoupling capacitor" (California Inventor)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,679, issued on Sept. 22, was assigned to KYOCERA AVX Components Corp. (Fountain Inn, S.C.).

"Package-on-package assembly containing a decoupling capacitor" was invented by Laurent Desclos (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "A microelectronic assembly comprising a first package comprising a first semiconductor structure electrically connected to a first package substrate and a second package electrically connected and disposed adjacent to the first package and that comprises a second semiconductor structure electrically connected to a second package substrate is provided. The assembly also comprises a decoupling capacitor that ...