ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,675, issued on Aug. 25, was assigned to Kuprion Inc. (Waterbury, Conn.).
"Metal-coated substrates, interposers, and methods for production thereof" was invented by Alfred A. Zinn (San Jose, Calif.), Alex Capanzana (San Jose, Calif.) and Hannah Thanh Zinn (Palo Alto, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Substrates may be metallized by introducing a seed layer upon a base substrate, mechanically polishing the seed layer, and forming a metal layer upon the seed layer after mechanical polishing. The base substrate may comprise a ceramic, such as silicon nitride or aluminum nitride, a polymer, silicon, metal, or glass. The seed layer opt...