US Patent Issued to Kulicke and Soffa Industries on Sept. 22 for "Wire bonding arrays, maintenance stations for wire bonding arrays, and related methods" (Singaporean, American Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,664, issued on Sept. 22, was assigned to Kulicke and Soffa Industries Inc. (Fort Washington, Pa.).

"Wire bonding arrays, maintenance stations for wire bonding arrays, and related methods" was invented by Michael Christopher Lamarra (Harleysville, Pa.) and Manoj Kumar Venna (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wire bonding array is provided. The wire bonding array includes a plurality of wire bonding systems, each of the plurality of wire bonding systems including a bond head assembly for bonding a wire to a workpiece and a support structure for supporting the workpiece. The wire bonding array also includes a wire bonding tool...