US Patent Issued to Kulicke and Soffa Industries on March 24 for "Wedge bonding tools and methods of forming wire bonds" (American, Singaporean Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,536, issued on March 24, was assigned to Kulicke and Soffa Industries Inc. (Fort Washington, Pa.).

"Wedge bonding tools and methods of forming wire bonds" was invented by Tyler Ownby (Celina, Texas), Tony Wong (Singapore), Raymond Chen (Cypress, Calif.), Christoph B. Luechinger (Irvine, Calif.), Tanbir Saini (Long beach, Calif.), Yahia Benhacene (El Cajon, Calif.) and Cristian Cionea (Aliso Viejo, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wedge bonding tool is provided. The wedge bonding tool includes a body portion including a tip portion, the tip portion terminating at a working end of the wedge bonding tool. The tip portion include...