US Patent Issued to Kulicke and Soffa Industries on June 9 for "Bonding systems for bonding a semiconductor element to a substrate, and related methods" (Pennsylvania Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,056, issued on June 9, was assigned to Kulicke and Soffa Industries Inc. (Fort Washington, Pa.).

"Bonding systems for bonding a semiconductor element to a substrate, and related methods" was invented by Adeel Ahmad Bajwa (Fort Washington, Pa.), Thomas J. Colosimo Jr. (Fort Washington, Pa.), Matthew B. Wasserman (Fort Washington, Pa.) and Robert N. Chylak (Fort Washington, Pa.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A bonding system for bonding a semiconductor element to a substrate is provided. The bonding system includes a reducing gas delivery system configured to provide a reducing gas to a bonding area of a bonding system. The bonding syst...