ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,780, issued on April 21, was assigned to Kulicke and Soffa Industries Inc. (Fort Washington, Pa.).
"Bonding systems using a predetermined tilt profile" was invented by Matthew Tarabulski (Ambler, Pa.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A bonding system for bonding a semiconductor element to a substrate is provided. The bonding system includes a bonding tool assembly for bonding a semiconductor element to a substrate. The bonding system also includes a support structure assembly for supporting the substrate. The bonding system further includes a vacuum sensor for sensing a vacuum leakage at an interface between the bonding tool assembly a...