ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,723, issued on April 7, was assigned to KUAN DING INDUSTRIAL Co. LTD. (New Taipei City, Taiwan).
"Heat conduction plate assembly structure" was invented by Kuan-Da Pan (New Taipei City, Taiwan) and Ming-Cheng Peng (New Taipei City, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A heat conduction plate assembly structure (1) includes a heat conduction plate (10) and a buffer pad (20). The heat conduction plate (10) includes a platform (11). The platform (11) includes an arc surface (111) attached to the heat-generating component (2) and an overflow slot (112) located on a side of the arc surface (111). The buffer pad (20) is fixed on the platf...