US Patent Issued to KOREA ELECTROTECHNOLOGY RESEARCH INSTITUTE on Aug. 4 for "Method for preparing polyimide aerogel having low dielectric properties, high insulation, and high strength, and polyimide aerogel produced therefrom" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,698,375, issued on Aug. 4, was assigned to KOREA ELECTROTECHNOLOGY RESEARCH INSTITUTE (South Korea).

"Method for preparing polyimide aerogel having low dielectric properties, high insulation, and high strength, and polyimide aerogel produced therefrom" was invented by Dae Ho Lee (Changwon-si, South Korea), Moon Jung Jo (Changwon-si, South Korea), Se Won Han (Changwon-si, South Korea), Seung Gun Yu (Paju-si, South Korea) and Hyo Yul Park (Changwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to: a method for producing a polyimide aerogel having low dielectric properties, high insulation, and high strength; a...