US Patent Issued to Korea Electronics Technology Institute on Nov. 3 for "Thermal resistance device including stress control pattern and manufacturing method thereof" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,784,942, issued on Nov. 3, was assigned to Korea Electronics Technology Institute (Seongnam-si, South Korea).

"Thermal resistance device including stress control pattern and manufacturing method thereof" was invented by Kyu Sik Shin (Seoul, South Korea) and Sung Min Hong (Hanam-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A thermal resistance device having a vanadium oxide layer and a method of manufacturing the thermal resistance device are proposed. The device may include a stress control pattern that can improve temperature coefficient of resistance (TCR) characteristics. The thermal resistance device may include a support comprising...