US Patent Issued to KOREA ELECTRONICS TECHNOLOGY INSTITUTE on March 17 for "Film for wrapping and manufacturing method thereof" (South Korean Inventor)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,579,909, issued on March 17, was assigned to KOREA ELECTRONICS TECHNOLOGY INSTITUTE (Seongnam-si, South Korea).

"Film for wrapping and manufacturing method thereof" was invented by Soon Hyung Kwon (Seongnam-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A film for wrapping including a heat shrinkable film shrinkable when the heat shrinkable film reaches a predetermined temperature, and a capsule layer formed at one surface of the heat shrinkable film while including a plurality of microcapsules is disclosed. Electrophoretic particles are included in the microcapsules. Accordingly, a color or text represented at the film for wrapping is ...