US Patent Issued to KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY on April 7 for "Acid anhydride compound, and polyamideimide resin and film using the same" (South Korean Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,595,268, issued on April 7, was assigned to KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY (Daejeon, South Korea).

"Acid anhydride compound, and polyamideimide resin and film using the same" was invented by Sang Youl Kim (Daejeon, South Korea) and Seong Jong Kim (Daejeon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are an acid anhydride compound having a novel structure, and a polyamideimide resin and a polyamideimide film produced therefrom. Specifically, since the polyamideimide film according to the present invention includes a structural unit derived from the acid anhydride compound, it may have high thermal resistance an...