US Patent Issued to Kookmin University Industry Academy Cooperation Foundation on Feb. 24 for "Ultra-thin transfer film of ultra-thin LED element for manufacturing ultra-thin LED electrode assembly using laser-assisted multi-chip transfer printing, ultra-thin LED electrode assembly, and manufacturing method thereof" (South Korean Inventor)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,564,005, issued on Feb. 24, was assigned to Kookmin University Industry Academy Cooperation Foundation (Seoul, South Korea).

"Ultra-thin transfer film of ultra-thin LED element for manufacturing ultra-thin LED electrode assembly using laser-assisted multi-chip transfer printing, ultra-thin LED electrode assembly, and manufacturing method thereof" was invented by Young Rag Do (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to an ultra-thin light-emitting diode (LED) electrode assembly, a manufacturing method of the ultra-thin LED electrode assembly, and a transfer film of an ultra-thin LED used for manufac...