US Patent Issued to KOKUSAI ELECTRIC on Sept. 29 for "Substrate processing apparatus, method of manufacturing semiconductor device, method of processing substrate, and recording medium" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,747,501, issued on Sept. 29, was assigned to KOKUSAI ELECTRIC Corp. (Tokyo).

"Substrate processing apparatus, method of manufacturing semiconductor device, method of processing substrate, and recording medium" was invented by Takafumi Sasaki (Toyama, Japan), Sadayoshi Horii (Toyama, Japan) and Mika Urushihara (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a technique that includes: a first nozzle arranged to correspond to a first region where a plurality of product substrates are arranged in a substrate arrangement region where a plurality of substrates are arranged in a reaction tube, the first nozzle supplying a hydro...