US Patent Issued to Kokusai Electric on Sept. 15 for "Seal structure, substrate processing apparatus, substrate processing method and method of manufacturing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,738,461, issued on Sept. 15, was assigned to Kokusai Electric Corp. (Tokyo).

"Seal structure, substrate processing apparatus, substrate processing method and method of manufacturing semiconductor device" was invented by Takayuki Sato (Toyama, Japan), Tetsuaki Inada (Toyama, Japan) and Kenta Sasaki (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to one aspect of the technique of the present disclosure, there is provided a seal structure capable of sealing a space between a first structure heated by a heater and a second structure arranged so as to face the first structure, the seal structure including: a metal plate arranged in c...