US Patent Issued to KOKUSAI ELECTRIC on Sept. 1 for "Substrate processing apparatus, susceptor assembly, method of manufacturing semiconductor device and substrate processing method" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,438, issued on Sept. 1, was assigned to KOKUSAI ELECTRIC Corp. (Tokyo).

"Substrate processing apparatus, susceptor assembly, method of manufacturing semiconductor device and substrate processing method" was invented by Yasutoshi Tsubota (Toyama, Japan), Takeshi Yasui (Toyama, Japan) and Tetsuaki Inada (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to one aspect of the technique in the disclosure, there is provided a substrate processing apparatus including: a process chamber in which a substrate is accommodated; a susceptor configured to support the substrate in the process chamber; and a susceptor cover provided on an upper...