US Patent Issued to Kokusai Electric on Nov. 3 for "Leakage detection apparatus, substrate processing apparatus, substrate processing method, method of manufacturing semiconductor device and non-transitory computer-readable recording medium" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,782,226, issued on Nov. 3, was assigned to Kokusai Electric Corp. (Tokyo).

"Leakage detection apparatus, substrate processing apparatus, substrate processing method, method of manufacturing semiconductor device and non-transitory computer-readable recording medium" was invented by Kazuhiro Umemoto (Toyama, Japan) and Hironobu Shimizu (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a technique that includes: two O-rings arranged between flanges facing each other, wherein the flanges connects pipes and the two O-rings seals an inside of each of the pipes from outside in a double seal manner; a communication hole provided at ...