US Patent Issued to Kokusai Electric on May 5 for "Cleaning method, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium" (Japanese Inventors)

ALEXANDRIA, Va., May 5 -- United States Patent no. 12,618,149, issued on May 5, was assigned to Kokusai Electric Corp. (Tokyo).

"Cleaning method, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium" was invented by Keigo Nishida (Toyama, Japan), Kenichi Ishiguro (Toyama, Japan) and Takashi Ozaki (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a technique that includes removing a substance adhering to the interior of the process container by performing a cycle a predetermined number of times under a first temperature, the cycle including: (a) supplying one gas of a nitrogen- and hydrogen-containing gas and a fluorine-containing gas...