US Patent Issued to KOKUSAI ELECTRIC on June 30 for "Substrate processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,668,878, issued on June 30, was assigned to KOKUSAI ELECTRIC Corp. (Tokyo).

"Substrate processing apparatus" was invented by Satoshi Takano (Toyama, Japan) and Shun Matsui (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Described herein is a technique capable of forming a film so as to fill a recess of a substrate. According to one aspect thereof, there is provided a substrate processing apparatus including: a substrate mounting table on which a substrate is placed; an adsorption inhibiting gas supplier configured to supply an adsorption inhibiting gas onto a surface of the substrate from above the substrate mounting table; and a source ga...