US Patent Issued to KOKUSAI ELECTRIC on June 23 for "Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium" (Japanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,906, issued on June 23, was assigned to KOKUSAI ELECTRIC Corp. (Tokyo).

"Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium" was invented by Jin Shibata (Toyama, Japan), Satoru Takahata (Toyama, Japan), Ichiro Nunomura (Toyama, Japan) and Gen Shikida (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A technique that includes: a substrate holder provided with a substrate mounting table on which a substrate is mounted; a substrate transferrer configured to load or unload the substrate onto or from the substrate mounting table; a process container configured to accommodate the substrate holder...