US Patent Issued to Kokusai Electric on July 7 for "Substrate processing method, method of manufacturing semiconductor device, non-transitory computer-readable recording medium and substrate processing apparatus" (Japanese Inventor)

ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,616, issued on July 7, was assigned to Kokusai Electric Corp. (Tokyo).

"Substrate processing method, method of manufacturing semiconductor device, non-transitory computer-readable recording medium and substrate processing apparatus" was invented by Hirohisa Yamazaki (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to the present disclosure, there is provided a technique capable of improving device characteristics. According to some embodiments of the present disclosure, there is provided a technique that includes: (A) processing a substrate by performing a first cycle a first predetermined number of times, wherein the first cyc...