US Patent Issued to KOKUSAI ELECTRIC on July 14 for "Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus, and recording medium" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,044, issued on July 14, was assigned to KOKUSAI ELECTRIC Corp. (Tokyo).

"Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus, and recording medium" was invented by Motomu Degai (Toyama, Japan), Kimihiko Nakatani (Toyama, Japan), Takashi Nakagawa (Toyama, Japan) and Takayuki Waseda (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a technique that includes: (a) supplying an adsorption suppressor to a substrate having a surface on which a first base and a second base are exposed under a first temperature to adsorb the adsorption suppressor on a surface of one base o...