US Patent Issued to Kokusai Electric on Aug. 25 for "Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus and non-transitory computer-readable recording medium" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,093, issued on Aug. 25, was assigned to Kokusai Electric Corp. (Tokyo).

"Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus and non-transitory computer-readable recording medium" was invented by Aiko Umeda (Toyama, Japan), Tsukasa Yashima (Toyama, Japan) and Yoshihiko Nakagawa (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a technique capable of stably form the film on a substrate regardless of machine difference or processing conditions. According to an aspect of the present disclosure, there is provided a technique that includes: (a) setting correction coeffici...