US Patent Issued to KOKUSAI ELECTRIC on Aug. 11 for "Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,918, issued on Aug. 11, was assigned to KOKUSAI ELECTRIC Corp. (Tokyo).

"Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium" was invented by Hiroshi Hirotani (Toyama, Japan), Akira Takahashi (Toyama, Japan) and Takuya Saito (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A technique that includes: a transfer chamber including a transfer space in which a substrate loaded from a substrate accommodation container is transferred; a gas circulation path connecting both ends of the transfer space; a fan in the gas circulation path for circulating atmosphere in the transfer space and the gas cir...