US Patent Issued to Kokusai Electric on April 14 for "Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium" (Japanese Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,601,058, issued on April 14, was assigned to Kokusai Electric Corp. (Tokyo).

"Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium" was invented by Yusaku Okajima (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to one aspect of a technique the present disclosure, there is provided a substrate processing apparatus including: a reaction tube in which a substrate is accommodated; a nozzle accommodation structure provided at a side surface of the reaction tube and extending in a direction parallel to a surface of the substrate; a gas supply nozzle inserted...