US Patent Issued to Kokusai Electric on April 14 for "Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,603,253, issued on April 14, was assigned to Kokusai Electric Corp. (Tokyo).

"Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium" was invented by Yasutoshi Tsubota (Toyama, Japan), Masanori Nakayama (Toyama, Japan), Katsunori Funaki (Toyama, Japan), Tatsushi Ueda (Toyama, Japan), Yuichiro Takeshima (Toyama, Japan), Keita Ichimura (Toyama, Japan), Hiroto Igawa (Toyama, Japan), Yuki Yamakado (Toyama, Japan) and Hiroki Kishimoto (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a technique that includes a process container including a cylindrical portion, a process chamber being...