US Patent Issued to KOKUSAI ELECTRIC on April 14 for "Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,601,059, issued on April 14, was assigned to KOKUSAI ELECTRIC Corp. (Tokyo).

"Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium" was invented by Yunosuke Sakai (Toyama, Japan), Takashi Ozaki (Toyama, Japan) and Keigo Nishida (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a technique that includes a first nozzle configured to supply a process gas to a process chamber that processes a substrate, a second nozzle arranged to be spaced apart by a predetermined distance from the first nozzle in a circumferential direction of the substrate and configured to supply an inert gas t...