US Patent Issued to KNAUF GIPS on June 30 for "High temperature sag resistant lightweight gypsum board" (Illinois Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,668,538, issued on June 30, was assigned to KNAUF GIPS KG (Iphofen, Germany).

"High temperature sag resistant lightweight gypsum board" was invented by Mark Hemphill (Hawthron Woods, Ill.) and Qinghua Li (Rolling Meadows, Ill.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A high temperature sag resistant lightweight wallboard. The addition of a small amount of urea (about 0.1%) significantly improves the high-temperature sag resistance on Type X gypsum wallboards. These gypsum wallboards may have a board weight of less than 2100 lbs/msf when cast to have an overall 5.8 inch thickness, and may include glass fibers and/or mineral wool. Also, methods of m...