US Patent Issued to Kioxia on Oct. 6 for "Wiring board, semiconductor device, and method for manufacturing semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,762, issued on Oct. 6, was assigned to Kioxia Corp. (Tokyo).

"Wiring board, semiconductor device, and method for manufacturing semiconductor device" was invented by Keiichi Niwa (Yokkaichi Mie, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to one embodiment, a wiring board, includes a conductive layer on a first surface and an insulating layer covering a portion of the conductive layer. The conductive layer includes a first connection portion exposed from the insulating layer and having a first wettability to solder, a lead-out portion connected to the first connection portion and exposed from the insulating layer and having a second...