US Patent Issued to Kioxia on Oct. 6 for "Encapsulating semiconductor chips using masks" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,793, issued on Oct. 6, was assigned to Kioxia Corp. (Tokyo).

"Encapsulating semiconductor chips using masks" was invented by Satoru Itakura (Tokyo) and Masayuki Miura (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to one embodiment, a method of manufacturing a semiconductor device includes placing a first semiconductor element on a wiring board, forming a first mask having an opening on the wiring board so that the first semiconductor element is positioned in the opening, putting a liquid first resin precursor into the opening of the first mask, curing the first resin precursor to obtain a first resin layer, and then removing the fir...