ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,768, issued on Oct. 20, was assigned to Kioxia Corp. (Tokyo).
"Semiconductor manufacturing apparatus and method of processing object" was invented by Shinsuke Muraki (Kuwana, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor manufacturing apparatus for processing an object having a first surface and a second surface opposite to the first surface, includes: a first processor having a chuck in a first chamber, the chuck having a chuck surface configured to chuck the object, the chuck surface having protrusions adjacent to each other along one direction of the chuck surface, the protrusions being configured to be pressed against the ...