US Patent Issued to Kioxia on March 31 for "Semiconductor device and method for manufacturing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,717, issued on March 31, was assigned to Kioxia Corp. (Tokyo).

"Semiconductor device and method for manufacturing semiconductor device" was invented by Kazushige Kawasaki (Kawasaki, Japan) and Satoru Itakura (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to one embodiment, a semiconductor device includes a wiring substrate having a first surface, a second surface opposite to the first surface, and a side surface connecting the first surface and the second surface. A first electrode is on the first surface. A semiconductor element is on the wiring substrate and electrically connected to the first electrode. A resin layer covers the ...