US Patent Issued to KIOXIA on March 3 for "Semiconductor device and method for manufacturing semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,826, issued on March 3, was assigned to KIOXIA Corp. (Tokyo).

"Semiconductor device and method for manufacturing semiconductor device" was invented by Yoshiharu Okada (Yokkaichi Mie, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a substrate, a spacer, and a first member. The spacer is disposed on the substrate, and has (i) a first surface facing the substrate, (ii) a second surface opposite to the first surface, and (iii) a third surface, at least part of the third surface forming an angle of less than 90 degrees with respect to the second surface. The first member is disposed on the substrate and, when viewed ...