US Patent Issued to KIOXIA on June 30 for "Semiconductor device and method of producing the same" (Japanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,548, issued on June 30, was assigned to KIOXIA Corp. (Tokyo).

"Semiconductor device and method of producing the same" was invented by Toshihiko Ohda (Yokkaichi Mie, Japan) and Yuusuke Takano (Yokkaichi Mie, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a wiring board having a first surface and a ground electrode exposed to the first surface, a stacked body provided above the first surface and having a chip structure body and a first resin layer that seals the chip structure body, a second resin layer that seals the stacked body, a third resin layer provided between the wiring board and the stacked body, and a f...