US Patent Issued to Kioxia on July 28 for "Substrate processing apparatus and substrate processing method" (Japanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,712, issued on July 28, was assigned to Kioxia Corp. (Tokyo).

"Substrate processing apparatus and substrate processing method" was invented by Takaumi Morita (Kuwana Mie, Japan), Hiroshi Fujita (Mie Mie, Japan), Tatsuhiko Koide (Kuwana Mie, Japan), Naomi Yanai (Kuwana Mie, Japan) and Tsubasa Watanabe (Yokkaichi Mie, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to one embodiment, a substrate processing apparatus includes a processing tank configured to store a chemical solution for processing a substrate by immersion in a chemical solution. The substrate is held by a holding member during the processing. A lid is configured to open ...